其它电力、电子

AIM 锡膏 SAC305 Sn100C, Sn/Bi

型号：	-
品牌：	AIM(Canada)
原产地：	加拿大
类别：	电子、电力 / 其它电力、电子
关键字：	无铅锡膏 , Sn100 , 蔡承煌
单价：	-
最少订量：	-
发布时间︰	2001/04/15
更新时间︰	2012/05/04

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公司信息详细信息

昭信企业有限公司

商务会员

国家/地区︰: 台湾

经营性质︰: 服务或其他

联系电话︰: 931127898

联系人︰: Frank Tsai (Manager)

最近登入︰: 2012/05/04

该公司所有产品信息 (50)

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产品描述

AIM SAC305, N100C, Sn42/Bi58 无铅锡膏,锡丝及各种特殊规格焊锡

Underfill, Adhesive 黏著胶

270WR VOC free 助焊剂

产品规格︰	AIM网站 NC257:USA SMT 2008 award vision winner underfill 620(CSP用充填胶):special for SCP usage New winner http://www.aimsolder.com/press_room_view.cfm?newsid=49 美国SMT学会得奖各种成份之锡膏:63/37,62/36/2,96/4,43/43/14---. 无铅焊锡: CASTIN(AIM拥有之专利):96.2%Tin(锡),2.5%Silver(银), 0.8%copper(铜),0.5%antimony(锑). SAC305:96.5%Tin(锡),3%Silver(银),0.5%copper(铜). Advantages Pin Probe testable residue(2 min. to 2 months).low process residue. reduce void on Micro BGA. high speed without slumping. high humidity & slump tolerance no clean,aqueous clean are acceptable. passing both SIR and Electromigration testing. on hard to-solder-materials, including bare copper and Alloy 42. Features mildly activated resin-base formula. meet variety alloys(Lead Free included). excellent wetting.extended idle time,tack time,stencil life. air reflow & nitrogen acceptable. *pass Bellcore,IPC reliability test. Easily pin probe tested High heat and humidity resistance Suitable for high-speed printing Residues safe to be left uncleaned on RF devices up to 50 gigahertz Eliminate solder defects such as voiding and solder beading

产品规格︰

AIM网站

NC257:USA SMT 2008 award vision winner

underfill 620(CSP用充填胶):special for SCP usage New winner

http://www.aimsolder.com/press_room_view.cfm?newsid=49

美国SMT学会得奖

*各种成份之锡膏:63/37,62/36/2,96/4,43/43/14---.
*无铅焊锡:
CASTIN(AIM拥有之专利):96.2%Tin(锡),2.5%Silver(银),
0.8%copper(铜),0.5%antimony(锑).

SAC305:96.5%Tin(锡),3%Silver(银),0.5%copper(铜).

Advantages
*Pin Probe testable residue(2 min. to 2 months).low process residue.
*reduce void on Micro BGA.
*high speed without slumping.
*high humidity & slump tolerance
*no clean,aqueous clean are acceptable.
*passing both SIR and Electromigration testing.
*on hard to-solder-materials, including bare copper and Alloy 42.

Features
*mildly activated resin-base formula.
*meet variety alloys(Lead Free included).
excellent wetting.extended idle time,tack time,stencil life.
*air reflow & nitrogen acceptable.
*pass Bellcore,IPC reliability test.
Easily pin probe tested
High heat and humidity resistance
Suitable for high-speed printing
Residues safe to be left uncleaned on RF devices up to 50 gigahertz
Eliminate solder defects such as voiding and solder beading

产品图片