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BGA100测试座采用的是弹片式OPEN-TOP结构，可用于自动机台和手动测试和烧录BGA100字库芯片，测试座的参数：.Open top,Zero Insertion Force designed for automatic loading
.Highly reliable,dual pinch , pre-loaded contacts
.For 0.50mm pitch packages
.Thru hole design
. Socket Body : PES,PEI
. Contact : Beryllium Copper Alloy
. Contact Plating : Gold over Nickel
. Contact Force:18g Per Pin (Normal)
. Operation Force 0.9 Kg MAX
. Contact Resistance:30mΩ Max , at 10mA and
同时我司有BGA100的翻盖烧录座，采用探针式结构，使用寿命10万次，欢迎咨询

20mV Max ( Initial)
. Insulation Resistance:1000mΩ Min . At DC 500V
. DielectricWithstanding Voltage For 1 Minute At AC 700V
. Operation Temperature: - 55℃~+175 ℃
. Life Span 15,000 Times ( Mechanical )