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1. 单组份导电银胶one-component conductive silver glue

单一组分，优异的导电性、韧性以及粘结强度，贮存稳定性好，贮存期长，成型工艺：150℃，60min。成型后干膜体积电阻率≤5×10－4Ω·cm。长期使用温度100℃左右，适用于多种电子元器件间的粘结。

single component, excellent conductivity、toughness and bonding strength, stable storage function , long storage time, forming process: 150 ℃, 60min. volume resistivity of curing film ≤ 5 × 10-4Ω · cm. Long-term working temperature is about 100 ℃, suitable for the bonding between a variety of electronic components.

2. 双组份导电银胶two-component conductive silver glue

A/B组分，优异的导电性、韧性以及粘结强度，贮存稳定性好，贮存期长，成型工艺：室温，24h或者室温，30min＋130℃，60min（成型工艺可根据用户要求现设计），体积电阻率≤5×10－4Ω·cm，粘结强度优异，适合低温工作环境。

A/B component, excellent conductivity、toughness and bonding strength, stable storage function , long storage time, forming process: room temperature,24h or room temperature,30min+ 130 ℃, 60min(forming process can be designed according to users’ requirements ) . volume resistivity of curing film ≤ 5 × 10-4Ω · cm. excellent bonding strength, suitable for low temperature working environment .

3. 耐高温导电银胶high temperature conductive silver glue

单一组分，长期耐温≤250℃，具有优异的导电性以及粘结强度，对大多数材料的粘结强度高，特别是对金属材料的粘结力好，施工性好，主要用于长期高温环境下使用的电子元器件的粘结，贮存期长。

Single component, long-term working temperature ≤ 250 ℃, excellent conductivity and bonding strength, high bonding strength with most materials especially metallic materials, good construction, mainly used for bonding between electronic components in long-term high temperature environment, long storage time.