产品描述
EVG®850 TB临时键合机
Features
- Open adhesive platform
- Various carriers (silicon, glass, sapphire, etc…)
- Bridge tool capability for different substrate sizes
- Available with multiple load port options and combinations
- Recipe controlled system
- Real time monitoring and recording of all relevant process parameters
- Fully integrated SECS/GEM interface
- Optional integrated inline metrology module for automated feedback loop
Technical Data
| Wafer diameter (substrate size) |
| Up to 300 mm, oversized carrier possible |
| Different substrate / carrier combinations |
| Configuration |
| Coat module |
| Bake module with multiple hot plates |
| Align module with optical or mechanical alignment |
| Bond module |
| Options |
| Inline Metrology |
| ID reading |
| High topography wafer handling |
|
Warped wafer handling
EVG®850 DB 解键合机
Features
- Reliable handling of thinned, bowed and warped wafers with and without topography
- Automated cleaning of debonded wafer
- Recipe controlled system
- Real time monitoring and recording of all relevant process parameters
- Fully integrated SECS/GEM interface in automated tools
- Bridge tool capability for different substrate sizes
- Modular tool layout → throughput-optimized depending on specific process
Technical Data
| Wafer diameter (substrate size) |
| Up to 300 mm |
| Up to 12“ film frame |
| Configuration |
| Debond module |
| Clean module |
| Film frame mounter |
| Options |
| ID reading |
| Various output formats |
| High topography wafer handling |
| Warped wafer handling |
|
产品图片
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